Failure Analysis Engineer, Device Test Engineer, Electronics Engineer

9/2006 - 12/2008

Qimonda

Individual Contributor

• • Using bitmap fail techniques and test data to correlate electrical fails to physical failures on trench capacitor DRAM memory chips • Analysis to determine the different leakage mechanisms of the bitcell • Managing the failure analysis lab queue by determining job priority and writing passdown for night-shift PFA technicians • Managing the work of 10 technicians • Using PFA technician SEM and FIB images to trace the cause of the failure to a particular process module • Presenting PFA results to 200 mm 110 nm node excursion meeting, 80 nm ramp meeting, and the TPLY defect meeting • Participated in Six-Sigma task force to decrease high yield impacting excursions • Writing technical reports detailing failure analysis process and conclusions.

10/2004 - 9/2006

Cree

Individual Contributor

• • Device characterization of SiC high power semiconductor devices for government research contracts • Measuring DMOSFET semiconductor parameters for PSPICE model and application notes • Switching measurements of Power MOSFETs, BJT’s , Schotkky diodes and PiN diodes to determine switching losses and delay times, and reverse recovery time • Designed a switch-mode boost converter circuit to illustrate the improved efficiency of silicon carbide power switches for high voltage, high frequency, and high temperature applications. • Reliability measurements of SiC DMOSFETs including power cycling, gate oxide stress , and avalanche energy tests

3/2001 - 8/2002

Dominion Semiconductor/ Micron Technology

Entry Level

• • Performed electrical device characterization on NVM Flash and DRAM memory chips using semiconductor analyzers, capacitance meters, probe stations, and other electrical test equipment. • Visually characterized failing mechanisms in memory chip using chemical and mechanical deprocessing techniques, SEM, FIB, and other PFA tools. • Analyzed MOSFET parametric test data, field bit maps, and yield sort data • Presented results of electrical characterization/physical failure analysis to device engineers and process engineers to aid in yield improvement • Left Micron Technology in August 2002 to start graduate school at Virginia Tech to study semiconductor device technology

2004

Master Degree

Virginia Tech

• Electrical Engineering

2000

Bachelor Degree

Clemson University

• Electrical Engineering