Description
PROFILE - I have more than 9 years of experience in Electronics Manufacturing specializing in Printed Circuit Board Assembly (PCBA) and Flexible Printed Circuit Assembly (FPCA) for HARD Disk Drives. - I have been involved in Test Engineering, DOA, Failure Analysis (FA) for in-house and external PCBA manufacturing operations, and In-Process Quality Control team for TOSHIBA Mfg. Line. - I lead various projects focusing on Pass Rate improvement, Material scrap reduction, Productivity improvement and Elimination of non-moving inventory that awarded me in Management Innovation. - I have been involved in cross Functional Team to resolve and correct quality issues and improve processes.
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