Description
PROFILE * Mechanical system architect for high-end electronics packaging, including racks and rails. * Proven design in Sheet metal electronic enclosures and assembly, System Racks, and plastic injection molded enclosures from concept to manufacturing release, Including POC and Prototyping. Also two design ideas that has been approved for patent. * System tolerance analysis, System Thermal analysis, and System stress analysis. * Direct experience with outside Labs and NEBS requirement and ATCA system design. * Constructing BOM, and create ECO, and ECR for system build and Operations. * Direct experience with DFM, DFA, and Kaizen. * Broad experience with manufacturing processes, metal forming, machining, plating, powder coating, wire EDM, chemical etching, and rapid prototyping. * Experience with high-volume manufacturing assembly techniques, such as Soldering, pick & place, vibratory bowl feeding, laser welding, ultrasonic welding, and automated process inspection. * Extensive vendor/partner relationship management, lead cross-functional teams, and responsible for validating and approval of plastic/sheet metal tooling made overseas.
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