Description
SUMMARY A Product Development / Technical Support / Testing Engineer with in-depth semiconductor physics knowledge and experience in Embedded Microcontroller Architectures, Flash Memories, VLSI CMOS mixed-signal devices, wafer / package assembly, ATE / bench testing, data analysis, characterization, qualification, new product release, and sustaining product engineering methods. Familiar with QS9000, ISO9001, TS16949, DOE's, DVP&R's, DFMEA, PFMEA, DFT, MIL-STD 883, EIA/JEDEC Standards, 8-D Reports, and high volume manufacturing principles. Knowledgeable in qualification / reliability tests such as OLT, Steady State Life, Temperature Cycling, Thermal Shock, HAST, Moisture Resistance, and Variable Frequency Vibration. Demonstrated leadership ability as Product Team Leader coordinating the efforts of cross-functional Product Development Teams consisting of (Design / Layout, Wafer Processing, Yield Enhancement, ATE Testing, Failure Analysis, Application Engineering and Marketing) for developing and qualifying new leading edge products for high volume manufacturing. Managed multiple complex domestic and international product engineering projects that resulted in an estimated $50 million generated in company revenue. Able to employ analytical, statistical, root cause / corrective action methods for device yield improvement, failure mode analysis, design performance enhancement, and customer satisfaction. A self-motivated team player with the ability to perform independently or in team environment. Possess excellent written / verbal communication and organizational attributes.
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