HDI methodologies such as layer stickups and impedance issues and HDI applications in the use of BGA's, BGA's, blind and buried vias and via in pad. * Designed all phases to include heat transfer, auto insertion, RF, impedance control, Circuit compatibility, shielding, critical circuit patterns as well as reliability and vibration / stress. * Worked with PLC specifications, Logic Diagrams, and PLC programing, Systems configuration including equipment layout. * Created and released mechanical drawings using AutoCAD Inventor, build of materials, netlists, Gerber files and vendor specifications.

Highlights:

Companies I like:

government, defense, automation, refinery , salesforce, AWC, siemens, Telsa, Amazon

• Failure Analysis
• Management
• Manufacturing
• Documentation
• Layout
• Reliability
• Rf
• Engineering
• Ethernet
• Networking