Description
Summary * 12 years' semiconductor HVM (High Volume Manufacturing) experience in Intel engineering team, responsible for equipment and process maintenance/improvement, new product introduction, new technology development and project management as well as technical leadership. * 5 years mechanical design experience in machinery and semiconductor equipment, successfully led team on whole equipment development. * High capability of quick learning and flawless execution with detail orientation Excellent stakeholder management skill and good team work spirit. * Equipment sustaining & development * Process maintenance & improvement (Spec/SOP/RFC) * New product introduction * Project management * Technical leadership * Equipment sustaining & development * Process maintenance & improvement (Spec/SOP/RFC) * New product introduction * Project management * Technical leadership * Quality maintenance (SPC/PCS/xRB) * Lean Manufacturing (6S/WPO/HPM/TPM) * Cost analysis/forecast * Data analysis (JMP/SQL) * Problem solving (FMEA/MBPS/5W1H) * MS-Office (Word/Excel/Visio/OneNote) * Quality maintenance (SPC/PCS/xRB) * Lean Manufacturing (6S/WPO/HPM/TPM) * Cost analysis/forecast * Data analysis (JMP/SQL) * Problem solving (FMEA/MBPS/5W1H) * MS-Office (Word/Excel/Visio/OneNote)
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