Description
Summary: With over 15 years of progressive experience in Process Engineering and Project Engineering, with hands on experience from Global Foundries, Samsung, Motorola, and L3-Communications. * Thorough understanding of Contamination Free Manufacturing, Lithography Process (i-line, DUV, Polyimide and Lift Off process) and Device Yield Enhancement methodology. * Direct Lithography process engineering experience working with ASML, and Nikon tools. * Familiar with PECVD, inspection tools, and Metrology (eBeam, SEM, OCD) * Change Point Management, root cause analysis and problem solving methods with hands on experience in SPC, Six Sigma methods, DOE and FMEA for complex data collection and analysis. * Field Application Engineering experience from Nikon, ASML and KLA-Tencor.
Accomplishments
Highlights:
Keywords
