Advanced CMOS device, SRAM memory technology (Bulk, FDSOI, FinFet) integration engineer works effectively with diverse stakeholders to successfully develop and transfer technology to high volume manufacturing.

Highlights:

• CMOS, SRAM, Memory
• device, Yield,
• Process Integration
• TCAD, FIELDAY, KLAYOUT, modelsim, Spice
• JMP, JSL,shell,
• Bulk, FDSOI, FinFet
• electrical, physical characterization,
• Standby power, Mismatch