Description
SUMMARY OF EXPERIENCE: Strong Background in the following areas: * Physics of semiconductors and semiconductor devices * In depth knowledge of theory, processing and application of semiconductor devices * MEMS (Micro-Electro mechanical Systems) design and processing * Theory and Technology of Bipolar and CMOS devices and ICs Hands- on experience in the following process areas * Oxidation and diffusion, Ion Implantation, Photolithography and Wet Etching. * Thin Film Deposition, PECVD, LPCVD, MOCVD, Sputtering, (RIE) Dry Etching. * Wafer planarization methods such as CMP, grinding, lapping, and polishing. * CMOS Front-end and Back-end Processing. * Wafer to wafer bonding. * Packaging of semiconductor devices and integrated MEMS Elements. * Sol-Gel processing for microelectronic chemical sensors. * Bulk Micro-machining, Surface Micro-machining (Silicon KOH and TMAH etching). * Failure analysis and reliability of MEMS devices and ICs (SEM, FIB, etc). * Gyroscope and Accelerometer releasing process. * Microelectronic hybrid processing. Hands on experience with process development (to reduce process variations) and product yield improvement. Proficient with DOE, SPC, DFMEA and PFMEA efforts during process development and production. Strong problem solving, project management and teamwork skills. Hands on experience with Tanner EDA layout (L-Edit), DRC and Coventor simulation tools. Experience with AutoCAD and SolidWorks. Project Management and Supervision of a group of Engineers and Technicians in Manufacturing. Taught undergraduate courses in: * Properties of semiconductor materials, Processing of semiconductor devices and ICs. * Analysis of crystallographic structure of solid state materials by X-rays, SEM.
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