Occupation:Electrical & Electronic Equipment Assembler |
Education Level:Associate |
Will Relocate:YES |
Description
I have designed diverse advanced combined ICT and FCT test applications on the GenRad 227x and 228x platforms for the last 25 years while working for IBM Corporation in Poughkeepsie, NY Charlotte, NC and Vimercate, Italy. Since graduation from IBM, my company TDM International has done business in the USA, Mexico and Brazil. Companies TDM International has provided solutions to: FAA, FAST, Flextronics, GE, Honeywell, Primus, Smiths, Solectron, ZF/Cherry, ResMed, Sanmina, et. al.
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