PROFESSIONAL SUMMARY Electronic Circuit Design Engineer with 30 years experience. Areas of expertise include Documentation Control of Schematics, Bill of Materials, Artwork, Assembly Fabrication, and all Applicable Design Data to ensure critical compliance of customer specifications for production scheduling. Design of Micro-BGA Modules and SMT for micro-electronic packages that include fcBGA, fcLGA, Stacked CSP, Wire Bond, Flip Stack, CABGA (Chip Array) SiP (System in Package), Stacked Die, Package on Package (PoP), package in package (PiP), Face-to-Face (F2F) and others. Printed Circuit Design for Switching Power Supplies that qualify for UL, CSA, VDE safety agency approval requirements.

Highlights:

• Documentation
• ACAD
• Autocad
• CAD/CAM Tools
• Cadence
• Certified Senior Advisor
• Chip Scale Packaging (CSP)
• Circuit Design
• Compliance
• Computer Vision