Description
Areas of expertise: * Based on solid theoretical knowledge stemming from years in research, hands-on experience with every step of processing and packaging of various types of LD and LED chips, devices and modules concentration in: * semiconductor lasers, optically pumped lasers, * UV LEDs, * SLEDs, * photo detectors, * HFETs, * MOSFETs * Comparative analysis of products ISO and AS * Hands-on experience with the entire industrialization cycle from research and development of processing and packaging lines, prototyping, to the industrial management of packaging, processing and assembly processes, reliability testing for processed and packaged chips, failure analysis. * Laboratory and industrial work with the following materials: * semiconductors nitrides, arsenides, phosphides and SiC * optical windows, silicone, ceramic, TO, butterfly, COB, SMD packaging * insulation films and compositions * metals, metallic alloys sand metallic multi-layer compositions and solders for microelectronic applications. Summary of Experience: * research-to-production transfer, management and technical support for processing and packaging * life time and burn-in testing, failure and correlation analyses, reverse engineering for adjustment of errors and flaws * prototyping, developing and installation of new products, products comparative analysis, testing and quality control * development of processes, Travelers and SOPs, testing protocols, training of operators and production engineers * development of packaging assembly, thermal and power management, factors analysis * optimization of devices according to the requested applications and customer specification * hands-on knowledge of the entire array of processing of LD, LED, PD - as well as transistors, chips, package and assembly designs * optimization of processing steps for product flow, market analysis * front-to-back practical knowledge of the packaging process for LD, LED singe and modules * optimization of packaging and assembly steps for product flow, market analysis - devices packages and assembly modeling.
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