Stats / Stats Chip Pac Work Values

Daily Duties at Stats / Stats Chip Pac:

Responsible for overseeing the deployment of FCI's wafer bumping and WLCSP technologies into the STATSChipPAC facility located in Singapore. Support customer needs in flip chip related bumping and assembly as well as support technical sales needs.

What they like about Stats / Stats Chip Pac:

The social vibrance of a hiring firm is very important to you. Your ability to make and maintain friendships there is a critical part of your decision. You would likely be dissatisfied with a workplace that is quiet, cold, or otherwise not particularly social. When you investigate a new hiring company, ask recruiters, managers, and potential co-workers about the social life and opportunities there. This is especially important when you are relocating; moving dramatically alters your social sphere both inside and outside the workplace.

Tags

Management, Manufacturing, Semiconductors, Development Activities, Flip Chip (FC), Licensing, Motorola, Applications, Due Diligence, Integrate, Semiconductor Packaging, Technology Due Diligence Assessment, International Technology Management, Experienced Executive Manager, Experienced BOD Member, International Technology Transfer, VP Technology - Medical Electronics

Skills

Program Management, International Management, Intellectual Property Development and Management, Semiconductor Packaging , Mentoring of Engineers and Mid-Level Managers, Technology Roadmapping and Execution, Technology Transfer Expertise, Managing Multidisciplinary Organizations

These are some of the questions we asked our climbers about their experiences with Stats / Stats Chip Pac: