St Microelectronics Work Values

Daily Duties at St Microelectronics:

While ST transitioned towards a leaner manufacturing model, much emphasis was placed on interactions with other ST R&D and manufacturing facilities, and manufacturing tool vendors. Quality, Cost, and On-time Deliveries to our customers were key priorities. Following are the highlights of my accomplishments at ST: • Implemented Quality programs and functions for Phoenix operations • Directed the overall manufacturing expansion from 4400 Wafers per week to ~7000 Wafers per week • Senior Director, Corporate Process Technology Department. Had direct interaction with other ST sites, foundries, and external vendors, on assessing their process technology, capability and product reliability below 130nm and 90nm technologies. • Facilitated multiple programs related to manufacturing processing, yield, and failure analysis for a new chip test vehicle among all ST sites. • Assisted in the design, layout, and manufacturing of metal interconnect structures to accommodate complex circuitry for different ST facilities. • Responsible for the evaluation of metallurgical and mechanical properties of metal interconnects and thin film properties used for advanced IC’s. • Transferred critical technical knowledge to different manufacturing sites in limited time. • Exceeded the target of $5M per manufacturing facility due to the implementation of novel processing methods. • Solved all IC process related technical problems for Back-End of the Line (BEOL) for all 8-inch and 6-inch facilities around the world (Asia, Europe, and USA). • Conducted reviews on a monthly basis with technical leaders from Process, R&D, Product Development and Quality Assurance groups around the world via NET-Meetings and Video conference calls. • Lead, coordinated and transferred all the Best Known Internal Methods (BKIM) from the best fabrication facility to other ST sites in limited time for maximum payback. • Deployed new process innovation and new design concepts to achieve optimum manufacturing capability among all ST fabrication sites. • Coordinated quarterly technical reviews and user meetings with different manufacturing tool suppliers like AMAT, Novellus, ASM, LAM etc., for Continuous Improvement Projects (CIP), tool performance, and new product deployment. • Lead and directed the Process Technical Committees (PTC) managers towards best manufacturing excellence by deploying lessons learned among all ST sites. • Followed upon the Yield Alert Notification (YAN) within limited time frames to minimize the scrap impact at other facilities. • Provided process transferring, characterizing, developing, and day-to-day fabrication support. Managed, developed and trained CVD, DVCD, Metals, and WCVD team engineers. • Participated in processing, developing and process transferring of new products for Wireless Division involving characterization of chip fabrication to chip design layouts and functionality.

What they like about St Microelectronics:

Organizations with strong, centralized leadership are particularly attractive to you. You require a work environment with leadership that aggressively seeks to expand and grow the business and does so in a visible and decisive manner. In general you prefer to work in an environment in which there is a strong link between leadership, its actions, and a strong set of company-wide values.

Tags

Lean Manufacturing, 6S, 6-Sigma, Manufacturing, Cycle time, Cost Reduction, CMOS, BiCMOS, FEA, FMEA's, 8D, JMP

Skills

• Proficient user of Windows 95/98/NT-4.0/2000, XP, VISTA, Windows-7 and Windows-8. • Experienced in the use of Microsoft Project, Microsoft Word, PowerPoint, Excel, Adobe Acrobat, KLA-XP, Proway, Tbox, SAS, RS1, Reflection, Firms, Workstream, Freel

These are some of the questions we asked our climbers about their experiences with St Microelectronics: