Universal Instruments Corporation Work Values

Daily Duties at Universal Instruments Corporation:

• Developed systematic understanding of the effects of Cu plating conditions on voiding at SAC/Cu interface • Gained in-depth experience with wet etching, reliability testing and statistical analysis of solder joints failure, and reflow profile design

What they like about Universal Instruments Corporation:

A hiring company that offers alternative approaches to pay, performance bonuses, and/or equity in the firm is very attractive to you. You're generally less interested in working for an organization offering only traditional, salary-based compensation, one with limited opportunity to acquire equity in the firm, or one that does not actively promote skill development. In addition, you are more likely to choose a company that offers a variety of internal career options, with defined career paths. You view the learning of new skills and development of your expertise as key to your career advancement. These aspects of an organization may become even more important to you as you progress in your field, and are especially critical if you change career or occupation.

Tags

solder metallurgy, material characterization, electron microcopy, failure analysis, failure analysis, EDS, WDS, SEM, TEM, XRD, think film deposition, EDS, WDS, SEM, TEM, XRD

Skills

• Expert in microstructure analysis techniques including SEM, EPMA, EDS, WDS, OM, X-ray, PVD, thermal analysis (reflow oven, DSC) and metallographic sample preparation , • Experienced in clean room, Photolithography, Profilometer, FIB, TEM, shear test and fatigue test, • Experienced in Fortran and C language for programming, spreadsheet programming, • Excellent in verbal and written communications , • Fluent in Chinese

These are some of the questions we asked our climbers about their experiences with Universal Instruments Corporation: