Universal Instruments Corporation Work Values

Daily Duties at Universal Instruments Corporation:

• Developed systematic understanding of the effects of Cu plating conditions on voiding at SAC/Cu interface • Gained in-depth experience with wet etching, reliability testing and statistical analysis of solder joints failure, and reflow profile design

What they like about Universal Instruments Corporation:

You give high priority to hiring firms with prestige. Market reputation and prestige of a firm may be determined through on-line research, and conversations with individuals working in your target industry. Note that firms "in the public eye" receive a great deal more critical publicity and attention than those operating with more anonymity. So as you assess your employment opportunities, be sure to seek out the positive aspects of the firm's reputation in addition to noting negative publicity the company may have received.

Tags

solder metallurgy, material characterization, electron microcopy, failure analysis, failure analysis, EDS, WDS, SEM, TEM, XRD, think film deposition, EDS, WDS, SEM, TEM, XRD

Skills

• Expert in microstructure analysis techniques including SEM, EPMA, EDS, WDS, OM, X-ray, PVD, thermal analysis (reflow oven, DSC) and metallographic sample preparation , • Experienced in clean room, Photolithography, Profilometer, FIB, TEM, shear test and fatigue test, • Experienced in Fortran and C language for programming, spreadsheet programming, • Excellent in verbal and written communications , • Fluent in Chinese

These are some of the questions we asked our climbers about their experiences with Universal Instruments Corporation: